Numerical modeling and prediction of thermomechanical degradation of power electronic packaging - Archive ouverte HAL Access content directly
Conference Papers Year : 2013

Numerical modeling and prediction of thermomechanical degradation of power electronic packaging

Abstract

This work aims at numerical thermomechanical studies of two types of high temperature silver connections elaborated at low temperatures, the transient liquid phase bonding (TLPB) of Ag-In and silver nanoparticles sintering, using test vehicles representing the final packaging assemblies of diamond components. The simulation is performed using a finite element code on 2D and 3D assemblies. The stress distribution in the assemblies and in the two die-attachments was studied during thermal cycling in the range temperature between -50 and 300°C. A comparison of these two technology trends with respect to their applicability for power electronics packaging was conducted.
Fichier principal
Vignette du fichier
Alexis_10599.pdf (242.44 Ko) Télécharger le fichier
Origin : Files produced by the author(s)
Loading...

Dates and versions

hal-00944556 , version 1 (10-02-2014)

Identifiers

  • HAL Id : hal-00944556 , version 1
  • OATAO : 10599

Cite

Ahlem Baazaoui, Olivier Dalverny, Joël Alexis, Moussa Karama. Numerical modeling and prediction of thermomechanical degradation of power electronic packaging. ICSAAM 2013, The 5th International Conference on Structural Analysis of Advanced Materials, Sep 2013, Island of Kos, Greece. ⟨hal-00944556⟩
58 View
93 Download

Share

Gmail Facebook X LinkedIn More