AlN/IDT/AlN/Sapphire as packageless structure for SAW applications in harsh environments
Résumé
Packageless heterostructure AlN/IDT/AlN/Sapphire was investigated as a solution protection of the interdigital transducer against agglomeration phenomena at high temperature. For this purpose, the performance of conventional IDT/AlN/Sapphire and protected AlN/IDT/AlN/Sapphire heterostructures were compared. The capability of AlN protective thin film to minimize the deterioration of electrodes was shown.