In-Situ Microtomographic Characterization of Single-Cavity Growth During High-Temperature Creep of Leaded Brass
Résumé
Synchrotron microtomography was used for in-situ characterization of high-temperature creep damage in leaded brass. Applying image registration to subsequent tomographic reconstructions, the volumetric growth rate of single cavities with equivalent radii between 2 and 4.3 mu m was assessed. We conclude from the volume dependence of the growth rates that both the viscous flow and grain boundary (GB) diffusion mechanisms influence void growth. We show that void growth in leaded brass is retarded by negative stress triaxiality, which develops in the matrix during heating the specimen to the deformation temperature.