System in-Package Solution with Dielectric resonator Antenna and Power Amplifier for a 60GHz High Data-Rate Transmitter
Résumé
Performance of a System in-Package (SiP) module is evaluated in this paper. The solution consists of a Dielectric Resonator Antenna (DRA) excited by a Power Amplifier (PA).The impact of the bond wire and the closed proximity of the PA element have been considered in the simulation for the co-design of this highly integrated sub-system. Experimental results show a total EIRP of 21 dBm measured for the PA/DRA configuration.