Thermal mechanical reliability issues in complex micro- and nano- electronic assemblies: a methodological approach - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2013

Thermal mechanical reliability issues in complex micro- and nano- electronic assemblies: a methodological approach

Fichier non déposé

Dates et versions

hal-00853816 , version 1 (23-08-2013)

Identifiants

  • HAL Id : hal-00853816 , version 1

Citer

Hélène Fremont. Thermal mechanical reliability issues in complex micro- and nano- electronic assemblies: a methodological approach. International Workshop on Nanopackaging, Jun 2013, France. ⟨hal-00853816⟩
34 Consultations
0 Téléchargements

Partager

Gmail Facebook X LinkedIn More