Comment on: Size effects on yield strength and strain hardening for ultra-thin Cu films with and without passivation: A study by synchrotron and bulge test techniques - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Scripta Materialia Année : 2012

Comment on: Size effects on yield strength and strain hardening for ultra-thin Cu films with and without passivation: A study by synchrotron and bulge test techniques

Résumé

Copper sub-micron films are structured as columnar arrays of grains and are virtual two-dimensional polycrystalline solids. By modelling their plastic deformation by a two-dimensional flow of sliding deformable grains, a new perspective of the mechanical tests of Gruber et al. [Acta Mater. 56 (2008) 2318] is attained that reveals remarkable regularities which are missed by the more conventional analysis of the authors. The model shows that two-dimensional plasticity has significant qualitative differences from the three-dimensional counterpart. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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Matériaux
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hal-00772733 , version 1 (11-01-2013)

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  • HAL Id : hal-00772733 , version 1

Citer

M. Lagos, V. Conte, M. Ignat. Comment on: Size effects on yield strength and strain hardening for ultra-thin Cu films with and without passivation: A study by synchrotron and bulge test techniques. Scripta Materialia, 2012, 67 (7-8), pp.736-739. ⟨hal-00772733⟩
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