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Article Dans Une Revue Microelectronics Reliability Année : 2012

Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength

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hal-00745982 , version 1 (26-10-2012)

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  • HAL Id : hal-00745982 , version 1

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S. Barnat, Hélène Fremont, Alexandrine Guedon-Gracia, Eric Cadalen. Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength. Microelectronics Reliability, 2012, 9-11 (52), pp 2278-2282. ⟨hal-00745982⟩
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