A novel, broadband (15 GHz) and high gain (6 dBi) antenna incorporated in package for the 60 GHz band is presented. This solution avoids separated process for antenna and the package. By the use of laser micromachining possibilities, the antenna-package element has been fabricated with alumina. The antenna is based on a dielectric resonator (DR) that is excited by a coplanar-line fed slot. A size of 36mm2 (6x6mm2) is achieved for the package including the antenna and the transmitter power amplifier chip. Interconnection chip-antenna is taken into consideration by use of solder balls from the flip-chip process.