3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules
Résumé
The classical wire bonding has several drawbacks that make 3D structures a desirable technology for a high performance power module. An interconnection solution for the power semiconductor dies is presented here: it is based on copper micro-posts that are electroplated on top of the die. The die with its micro-posts is then assembled between two Direct Bonding Copper (DBC) substrates using a direct copper-to-copper bond method. This direct bond method is achieved using a Spark Plasma Sintering (SPS) process machine. Manufacturing and electrical characterization of a power semiconductor die with the micro-posts interconnection is presented in details.
Domaines
Energie électrique| Origine | Fichiers produits par l'(les) auteur(s) |
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