This paper describes a new collective microfabrication process of all-organic microcantilever chips. This method is based on the hierarchical combination of shadow-masking and wafer-bonding processes. The shadow-masking combines deposition and patterning in one step thanks to spray-coating through a polymer microstencil that gives the opportunity of patterning thermosensitive material such as PMMA. The shadow-masking parameters have been optimized to obtain suspended microcantilevers characterized by a convenient thickness profile. The resulting PMMA structures were then transferred onto SU-8 chips by using an SU-8 waferbonding process. The effect of the UV exposure dose of both SU-8 layers in contact on the bonding quality has been investigated and optimized. With the optimized bonding process we have achieved the large scale transfer of microstructures with a yield of 100% and a bond strength of 50 MPa. These microcantilevers were also tested at resonance, to determine Young’s moduli of patterned polymers. The low values obtained (below 5 GPa) make these organic MEMS structures strong candidates for highly sensitive sensing applications when used in the static mode.