Microstructure and texture analysis of advandced copper interconnects using Electron Backscattered Difraction and Scanning Transmission Electron Microscopy - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2010

Microstructure and texture analysis of advandced copper interconnects using Electron Backscattered Difraction and Scanning Transmission Electron Microscopy

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Matériaux
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hal-00609349 , version 1 (18-07-2011)

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  • HAL Id : hal-00609349 , version 1

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R. Galand, L. Clément, P. Waltz, Y. Wouters. Microstructure and texture analysis of advandced copper interconnects using Electron Backscattered Difraction and Scanning Transmission Electron Microscopy. SPIE Scanning Microscopy 2010, May 2010, MONTEREY, Californie, United States. ⟨hal-00609349⟩
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