First CMOS Integration of Ultra Thin Body and BOX (UTB2) Structures on Bulk Direct Silicon Bonded (DSB) - Archive ouverte HAL
Communication Dans Un Congrès Année : 2009

First CMOS Integration of Ultra Thin Body and BOX (UTB2) Structures on Bulk Direct Silicon Bonded (DSB)

Fichier non déposé

Dates et versions

hal-00603803 , version 1 (27-06-2011)

Identifiants

  • HAL Id : hal-00603803 , version 1

Citer

G. Bidal, F. Boeuf, S. Denorme, C. Laviron, K. Bourdelle, et al.. First CMOS Integration of Ultra Thin Body and BOX (UTB2) Structures on Bulk Direct Silicon Bonded (DSB). IEEE International Electron Devices, Dec 2009, Balitimore, United States. ⟨hal-00603803⟩
46 Consultations
0 Téléchargements

Partager

More