Communication Dans Un Congrès Année : 2009

Modelling of Through Silicon Via RF Performance and Impact on Signal Transmission in 3D Integrated Circuits

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hal-00602867 , version 1 (23-06-2011)

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  • HAL Id : hal-00602867 , version 1

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L. Cadix, A. Farcy, C. Bermond, C. Fuchs, P. Leduc, et al.. Modelling of Through Silicon Via RF Performance and Impact on Signal Transmission in 3D Integrated Circuits. Modelling of Through Silicon Via RF Performance and Impact on Signal Transmission in 3D Integrated Circuits, Sep 2009, San Francisco, United States. ⟨hal-00602867⟩
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