Communication Dans Un Congrès Année : 2009

RF characterization and modeling of high density Through Silicon Vias for 3D chip stacking

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hal-00602817 , version 1 (23-06-2011)

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  • HAL Id : hal-00602817 , version 1

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L. Cadix, A. Farcy, C. Bermond, C. Fuchs, F. Lorut, et al.. RF characterization and modeling of high density Through Silicon Vias for 3D chip stacking. RF characterization and modeling of high density Through Silicon Vias for 3D chip stacking, Mar 2009, Grenoble, France. ⟨hal-00602817⟩
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