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Article Dans Une Revue Scripta Materialia Année : 2010

A discrete dislocation dynamics modelling for thermal fatigue of preferred oriented copper via patterns.

Résumé

A numerical modeling, which is hierarchically coupled with the crystal plasticity finite element method and discrete dislocation dynamics, was performed to examine thermal fatigue behavior of via pattern in ultra-large-scale copper interconnections. The pattern had a pillar shape and one of three crystallographic orientations, 〈0 0 1〉, 〈1 1 0〉 and 〈1 1 1〉, along its longitudinal direction. The internal stress and surface morphology on via patterns could be obtained considering the generation of dislocations and their motion. A robust via pattern in terms of crystallographic orientation was suggested.

Domaines

Matériaux

Dates et versions

hal-00581462 , version 1 (30-03-2011)

Identifiants

Citer

Gyu Seok Kim, Fivel Marc, Hyo-Jong Lee, Chansun Shin, Heung Nam Han, et al.. A discrete dislocation dynamics modelling for thermal fatigue of preferred oriented copper via patterns.. Scripta Materialia, 2010, 63 (7), pp.788-791. ⟨10.1016/j.scriptamat.2010.06.018⟩. ⟨hal-00581462⟩
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