Giving an existing manufacturing technology, the influence of design parameters has been evaluated in order to improve robustness of 3D capacitors. The objective is to select capacitor patterns that provide a satisfying density with the required robustness with respect to reliability indicators. The geometrical and the manufacturing related issues are both considered. The main manufacturing issues are: etching, deposition and warpage of the wafer. Improvements have been observed experimentally for the robustness of 3D structures and the density of the capacitor which are increased for several proposed 3D pattern. All capacitors tested in this paper are realized with PICS technology.