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Communication Dans Un Congrès Année : 2010

New millimeter wave packaged antenna array on IPD technology

Résumé

In the millimeter wave (mmWave) frequency range, the recent advances in CMOS and BiCMOS technologies make possible the integration of entire RF frontends on the same chip (System on Chip (SoC) approach). The present challenge concerns the antenna integration within the packaging (System in Package (SiP) approach) which will support the complete analog and digital system. Integrated antennas on silicon cannot exhibit gain performances greater than 7dBi, typically, (14 dBi as currently expected by future normalized IEEE-802.15.3c Usage Models (UM1 to UM5)). In this paper, we propose a novel antenna array combining Glass/Silicon technologies, suitable for mmWave integrated packaging and achieving the required 14dBi gain values for applications such as Wireless HDMI (High-Definition Multimedia Interface) downloading applications.

Domaines

Electronique
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Dates et versions

hal-00451409 , version 1 (29-01-2010)

Identifiants

  • HAL Id : hal-00451409 , version 1

Citer

Christophe Calvez, Christian Person, Jean-Philippe Coupez, François Gallée, Hilal Ezzeddine, et al.. New millimeter wave packaged antenna array on IPD technology. SiRF Conference : IEEE 10th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Jan 2010, New Orleans, United States. ⟨hal-00451409⟩
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