Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations - Archive ouverte HAL
Article Dans Une Revue IEEE Transactions on Device and Materials Reliability Année : 2008

Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations

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Electronique

Eric Woirgard  : Connectez-vous pour contacter le contributeur

https://hal.science/hal-00403579

Soumis le : vendredi 10 juillet 2009-16:02:16

Dernière modification le : lundi 11 septembre 2023-16:36:51

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hal-00403579 , version 1 (10-07-2009)

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  • HAL Id : hal-00403579 , version 1

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Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini. Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations. IEEE Transactions on Device and Materials Reliability, 2008, 8 (3), pp.449-454. ⟨hal-00403579⟩

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