Thermal Transient Characterization of Electronic Assemblies by Infrared Thermography and DeltaVbemeter Methods
Résumé
The severe environment of electronic systems means that the design of electronic boards requires continual investigation, involving not only electronics but also thermal and thermomechanical studies.We present here two complementary experimetal methods to characterize the thermal transient behaviour of electronic assemblies and we compare the results obtained. Then, we conclude by presenting the fields of applications for such test equipments.