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Communication Dans Un Congrès Année : 2008

Durability modelling of a BGA component under random vibration

Gregor Massiot
  • Fonction : Auteur
Olivier Maire
  • Fonction : Auteur
Agnès Chaillot
  • Fonction : Auteur
Catherine Munier
  • Fonction : Auteur

Résumé

This study introduces a computation method to assess damage in electronic solder joints under random vibration. It addresses full 3D dynamic behaviour of electronic board. Finite Element Modelling (FEM) of electronic BGA (Ball Grid Array) and CGA (Column Grid Array) packages assemblies are developped and adjusted with experimental modal identification of the test board. Vibration FEM simulations are performed to calculate stress transfer functions of critical solder joints. Then, solder joint time-stress responses due to an input random excitation of the board are generated. Stress range distributions are established from rainflow counting. Finally, linear damage computation is done and compared with experimental results by using an empirical damage law. The potential and the limitation of this method are discussed.
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Dates et versions

hal-00329696 , version 1 (13-10-2008)

Identifiants

Citer

Marc Grieu, Gregor Massiot, Olivier Maire, Agnès Chaillot, Catherine Munier, et al.. Durability modelling of a BGA component under random vibration. Thermal, mechanical and multi-physics, simulation and experiments in microelectronics and micro-systems 2008, Apr 2008, France. 8 p., ⟨10.1109/ESIME.2008.4525047⟩. ⟨hal-00329696⟩
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