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Communication Dans Un Congrès Année : 2007

A novel zero-level packaging using BCB adhesive bonding and glass wet-etching for millimeter-wave applications

N. Rolland
P.A. Rolland
  • Fonction : Auteur
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Dates et versions

hal-00284092 , version 1 (02-06-2008)

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S. Seok, N. Rolland, P.A. Rolland. A novel zero-level packaging using BCB adhesive bonding and glass wet-etching for millimeter-wave applications. 14th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers'07, 2007, France. pp.2099-2102, ⟨10.1109/SENSOR.2007.4300579⟩. ⟨hal-00284092⟩
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