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Communication Dans Un Congrès Année : 2008

UV Direct-Writing of Metals on Polyimide

Jack Hoyd-Gigg Ng
  • Fonction : Auteur
  • PersonId : 848984
Marc Desmulliez
  • Fonction : Auteur
  • PersonId : 848917
Aongus Mccarthy
  • Fonction : Auteur
  • PersonId : 848985
Himanshu Suyal
  • Fonction : Auteur
  • PersonId : 848986
Kevin Prior
  • Fonction : Auteur
  • PersonId : 848987
Duncan P. Hand
  • Fonction : Auteur
  • PersonId : 848988

Résumé

Conductive micro-patterned copper tracks were fabricated by UV direct-writing of a nanoparticle silver seed layer followed by selective electroless copper deposition. Silver ions were first incorporated into a hydrolyzed polyimide surface layer by wet chemical treatment. A photoreactive polymer coating, methoxy poly(ethylene glycol) (MPEG) was coated on top of the substrate prior to UV irradiation. Electrons released through the interaction between the MPEG molecules and UV photons allowed the reduction of the silver ions across the MPEG/doped polyimide interface. The resultant silver seed layer has a cluster morphology which is suitable for the initiation of electroless plating. Initial results showed that the deposited copper tracks were in good agreement with the track width on the photomask and laser direct-writing can also fabricate smaller line width metal tracks with good accuracy. The facile fabrication presented here can be carried out in air, at atmospheric pressure, and on contoured surfaces.

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Autre [cs.OH]
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Dates et versions

hal-00277741 , version 1 (07-05-2008)

Identifiants

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Jack Hoyd-Gigg Ng, Marc Desmulliez, Aongus Mccarthy, Himanshu Suyal, Kevin Prior, et al.. UV Direct-Writing of Metals on Polyimide. DTIP 2008, Apr 2008, Nice, France. pp.360-363. ⟨hal-00277741⟩

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