AN INTEGRATED CIRCUIT COMPATIBLE COMPACT PACKAGE FOR THERMAL GAS FLOWMETERS
Résumé
An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.
Origine : Fichiers produits par l'(les) auteur(s)
Loading...