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Communication Dans Un Congrès Année : 2007

A Two-Step Etching Method to Fabricate Nanopores in Silicon

Résumé

A cost effectively method to fabricate nanopores in silicon by only using the conventional wet-etching technique is developed in this research. The main concept of the proposed method is a two-step etching process, including a premier double-sided wet etching and a succeeding track-etching. A special fixture is designed to hold the pre-etched silicon wafer inside it such that the track-etching can be effectively carried out. An electrochemical system is employed to detect and record the ion diffusion current once the pre-etched cavities are etched into a through nanopore. Experimental results indicate that the proposed method can cost effectively fabricate nanopores in silicon.

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Dates et versions

hal-00257682 , version 1 (20-02-2008)

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G.-J. Wang, W.-Z. Chen, K.J. Chang. A Two-Step Etching Method to Fabricate Nanopores in Silicon. DTIP 2007, Apr 2007, Stresa, lago Maggiore, Italy. pp.169-172. ⟨hal-00257682⟩

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