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Communication Dans Un Congrès Année : 2007

Tungsten/Copper Functionnally graded materials: possible applications and processing through the powder metallurgy route

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hal-00195743 , version 1 (11-12-2007)

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  • HAL Id : hal-00195743 , version 1

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O. Ozer, J.M. Missiaen, C. Pascal, S. Lay, J.M. Chaix, et al.. Tungsten/Copper Functionnally graded materials: possible applications and processing through the powder metallurgy route. 2006 Powder Metallurgy World Congress, 2006, South Korea. pp.1569-1572. ⟨hal-00195743⟩

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