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Communication Dans Un Congrès Année : 2007

Impact of Post Via Clean Solution on Self Aligned Barrier Integrity: Corrosion and Cu/Co Galvanic Coupling

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hal-00194908 , version 1 (07-12-2007)

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  • HAL Id : hal-00194908 , version 1

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C. Pernel, S. Bilouk, R.P. Nogueira, G. Passemard. Impact of Post Via Clean Solution on Self Aligned Barrier Integrity: Corrosion and Cu/Co Galvanic Coupling. Advanced Metallization Conference (AMC), 2007, United States. a paraitre. ⟨hal-00194908⟩

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