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Communication Dans Un Congrès Année : 2007

Electrochemical Behavior of Copper in Post-Etch Cleaning Solutions

Résumé

The actions of glycolic acid and BTA on copper have been investigated by electrochemical methods. Different concentrations in glycolic acid were investigated: 1%wt, 2%wt, 3%wt and 4%wt. Results show that the cleaning action of glycolic acid results from smooth corrosion of the metal. Copper dissolution increases with glycolic acid concentration due to the formation of a copper complex which precedes copper dissolution. In the presence of BTA, a corrosion inhibitor of copper, a [Cu(I)BTA] complex is formed on the surface which blocks copper dissolution. In a mixture of glycolic acid and BTA (1%wt/ 0.1%wt), an intermediary behavior is observed. A competitive action occurs between the film formation due to the interaction between BTA and copper and the superficial etching of the metal by glycolic acid which removes the inhibitor-copper film.
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Dates et versions

hal-00194904 , version 1 (07-12-2007)

Identifiants

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Sabrina Bilouk, Carole Pernel, Ricardo Nogueira, Lucile Broussous, Paul-Henri Haumesser, et al.. Electrochemical Behavior of Copper in Post-Etch Cleaning Solutions. 212th Electrochemical Society Meeting, 2007, Chicago, United States. ⟨10.1149/1.2779403⟩. ⟨hal-00194904⟩
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