Comparison of structural and electrical properties of PMN-PT films deposited on Si with different bottom electrodes - Archive ouverte HAL
Article Dans Une Revue Journal of Crystal Growth Année : 2007

Comparison of structural and electrical properties of PMN-PT films deposited on Si with different bottom electrodes

Résumé

PMN-PT (70/30) thin films were deposited by sputtering on silicon substrate covered with different bottom electrodes: TiOx/Pt and LaNiO3 (LNO). The bilayers TiOx/Pt are deposited by sputtering and the LNO layer by sol–gel. Whatever the bottom electrodes the perovskite phase appears at 400 °C; the existence of a buffer layer (Pb2Nb2O7) between the PMN-PT film and the bottom electrode could explain the perovskite formation of the PMN-PT films at this low temperature. We have studied the interfacial layer by transmission electron microscopy (TEM), high-resolution X-ray diffraction (HR XRD), and the measurement of the dielectric properties of the structures. The dielectric measurements are in accordance with the TEM and HR XRD analysis: the existence of a Pb2Nb2O7 interfacial layer which can play the role of a buffer layer as well on LNO as TiOx/Pt.

Dates et versions

hal-00176607 , version 1 (04-10-2007)

Identifiants

Citer

M. Detalle, Gang Wang, Denis Remiens, P. Ruterana, P. Roussel, et al.. Comparison of structural and electrical properties of PMN-PT films deposited on Si with different bottom electrodes. Journal of Crystal Growth, 2007, 305 (1), pp.137-143. ⟨10.1016/j.jcrysgro.2007.04.020⟩. ⟨hal-00176607⟩
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