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Article Dans Une Revue Defect and Diffusion Forum Année : 2005

Grain boundary diffusion in Ni in NiTi shape memory alloys

Résumé

Ni grain boundary diffusion was measured in slightly Ti rich polycrystalline NiTi shapememory alloy in the temperature range of 428-678K. Grain boundary tail in the penetration plots could only be detected below 700 K. The temperature dependence of the grain boundary triple product P (P=c')]J&k, (): grain boundary width, Db : grain boundary diffusion coefficient, k: segregation factor) can be represented by the following Arrhenius parameters: pre-exponential factor: P0=2.6*10-18m3s-1, activation energy: Qb=90 kJmor-1. The order of magnitude of the triple product Ni Ti at a reduced temperature scale is similar to that of the grain boundary diffusivity measured in other B2 systems, but the detection of it is difficult, because there is not enough contrast between the volume and the grain boundary diffusion.
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Dates et versions

hal-00019786 , version 1 (09-06-2023)

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J. Nyéki, G. Erdélyi, Christian Lexcellent, Jean Bernardini, Dezső Beke. Grain boundary diffusion in Ni in NiTi shape memory alloys. Defect and Diffusion Forum, 2005, 237-240, pp. 543-547. ⟨10.4028/www.scientific.net/DDF.237-240.543⟩. ⟨hal-00019786⟩
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