Communication Dans Un Congrès Année : 2014

(Invited) Temperature Impact on Reliablity and Manufacturing of Embedded HfOx-Based RRAM: a Novel Pre-coding Method for Bypassing Soldering Reflow

Résumé

This paper proposes a novel pre-coding method that enables bypassing the soldering reflow issue in resistive memory devices called RRAM. This method is based on the difference between forming and set voltages distributions to discriminate virgin memory cells from those in which data were pre-coded before the soldering step. This procedure enables data recovery through the application of a voltage pulse over the whole memory array. This method, demonstrated on bipolar HfO 2 -based resistive elements, can be extended to all RRAM devices that exhibit a significant margin between forming and set voltages distributions.

Dates et versions

hal-05006795 , version 1 (26-03-2025)

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Citer

Sauveur Tirano, Luca Perniola, Carlo Cagli, Eric Jalaguier, Vincent Jousseaume, et al.. (Invited) Temperature Impact on Reliablity and Manufacturing of Embedded HfOx-Based RRAM: a Novel Pre-coding Method for Bypassing Soldering Reflow. ECS Meetings, May 2014, Orlando (Florida), United States. pp.311-313, ⟨10.1149/06102.0311ecst⟩. ⟨hal-05006795⟩
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