Communication Dans Un Congrès Année : 2023

Direct cooling of power modules by two-phase systems

Résumé

In the scope of electrification - especially in the aeronautic world - reducing the impact of onboarding new power electronic systems is paramount. Every aspect has to be worked on, from Electro-Magnetic Compatibility (EMC) to semiconductor but also thermal systems. As really high power (up to 10 MW) starts to be thought to be embedded into aircrafts and even though power converters easily reach 99% efficiency, huge amounts of heat have to be extracted.
Using components on the shelf (COTS) for converters implies deported cooling, i.e. the module and the cooling system (either heatsink or cold plate) are 2 different subsystems. This has the upside of ease of setup but the downside of adding thermal resistances between the semiconductors and the cold source, leading to a colder coolant temperature than the approach we propose. Previously to this work Airbus worked on including heatsinks inside the design of the power converter, providing much more efficient but still showing limitations. Depending on heatsinks' geometries, it can be hard to braze them on the converters, also the heat flux still has to go through ceramic materials before getting to the heatsinks.
With this study, we propose to get rid of heatsinks all together and apply the coolant directly to the semiconductors. This simplifies the build of modules but, because heat fluxes are really high due to the small footprint of semiconductors, the use of liquid/vapor two phase cooling becomes a necessity. In order to cover this topic, a purposely built module will be the end target. Before that, more simplified versions will be created to better understand the impact of discrete heat sources on two phase flow during evaporating and boiling process. Parallel to that, simulations using Stardis and Comsol will be performed.

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Dates et versions

hal-04889905 , version 1 (15-01-2025)

Identifiants

  • HAL Id : hal-04889905 , version 1

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Antoine Loehrmann, Vincent Ayel, Étienne Videcoq, Sébastien Dutour, Benjamin Piaud, et al.. Direct cooling of power modules by two-phase systems. 16th Advanced Technology Workshop on Micropackaging and Thermal Management, International Microelectronics And Packaging Society (IMAPS), Mar 2023, Chasseneuil-du-Poitou, France. ⟨hal-04889905⟩
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