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            <idno type="halRefHtml">&lt;i&gt;IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society&lt;/i&gt;, Oct 2018, Washington, France. pp.1531-1536, &lt;a target="_blank" href="https://dx.doi.org/10.1109/IECON.2018.8592696"&gt;&amp;#x27E8;10.1109/IECON.2018.8592696&amp;#x27E9;&lt;/a&gt;</idno>
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                <term xml:lang="en">Power Active Cycling</term>
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                <term xml:lang="en">ageing</term>
                <term xml:lang="en">Remaining Useful Lifetime</term>
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              <p>&lt;div&gt;&lt;p&gt;Electrical conversion in aerospace applications faces important issues to gain in reliability, efficiency and profitability. This paper focuses on preliminary analyses towards condition monitoring for new power modules based on 2D interconnection of SiC power MOSFETs for 600V, 90A applications. Power modules are so far lab-scale samples on which failure analyses and ageing have not been covered. Based on literature, a test plan has been established to trigger expected failure modes. Using temperature-sensitiveelectrical parameters, it is expected to identify signatures of failures. In a short-term, laws of failures will be evaluated based on signatures for the prognostic of the lifetime consumption of the module. Paper details the experimental setup, calibration steps and data monitoring towards identification of ageing signatures. Data analyses are detailed&lt;/p&gt;&lt;/div&gt;</p>
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