Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging - Archive ouverte HAL
Proceedings/Recueil Des Communications Année : 2023

Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging

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hal-04654848 , version 1 (20-07-2024)

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Juliano Borges, Maxime Darnon, Yann Beilliard, Serge Ecoffey, Isabel de Sousa, et al.. Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), IEEE, pp.1369-1373, 2023, ⟨10.1109/ECTC51909.2023.00234⟩. ⟨hal-04654848⟩
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