1.65 ¼m L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
Hussein Hamieh
(1, 2)
,
Juliano Borges
(1, 2)
,
Étienne Paradis
(1, 2)
,
Yann Beilliard
(1, 2)
,
Serge Ecoffey
(3)
,
Isabel de Sousa
(3)
,
Martin Laliberte
(1, 2)
,
Dominique Drouin
(1, 2)