Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid - Archive ouverte HAL
Proceedings/Recueil Des Communications Année : 2024

Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid

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hal-04654838 , version 1 (20-07-2024)

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Arsène Guédon, Nizar Bouguerra, Etienne Paradis, Eric Duchesne, Stephanie Allard, et al.. Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid. IEEE Electronic Components and Technology. 2024 IEEE 74th Electronic Components and Technology Conference, 2024, ⟨10.1109/ECTC51529.2024.00245⟩. ⟨hal-04654838⟩
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