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              <p>This work introduces an innovative real-time cure monitoring method for Carbon Fibre Reinforced Polymer (CFRP) manufacturing, using Electrical Impedancemetry (EI) and self-sensing material. The method monitors changes in the electrical complex impedance, which can be related to the degree of cure of the thermoset matrix. The study was initially conducted using a commercial single-channel impedance analyzer, HIOKI, which had limitations in terms of measurement channels and data acquisition rate. To overcome these limitations, a new EI measurement bench was developed. This multi-channel bench, based on the Digilent PmodIA module and an Analog-Front-End (AFE), costs only 15% of the HIOKI analyzer and has a data acquisition rate 48 times higher. It maintains an equivalent impedance measurement range and allows for the monitoring of the degree of cure and oven temperature, as well as the detection of potential cure cycle issues. The method was validated on different CFRPs, showing a significant difference in cure behavior between unreinforced resins and composites. The EI results were in good agreement with those obtained by rheometer and differential scanning calorimetry. This approach will contribute to the Structures Health Monitoring (SHM) of CFRP and the functionalization of carbon/epoxy composites and will be used for refining electrical-mechanical modelling during curing and mechanical loading.</p>
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