Thermal-solutal convection-induced low-angle grain boundaries in single-crystal nickel-based superalloy solidification - Archive ouverte HAL
Article Dans Une Revue Journal of Materials Science and Technology Année : 2025

Thermal-solutal convection-induced low-angle grain boundaries in single-crystal nickel-based superalloy solidification

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Yancheng Zhang  : Connectez-vous pour contacter le contributeur

https://hal.science/hal-04595122

Soumis le : jeudi 30 mai 2024-19:59:15

Dernière modification le : vendredi 31 mai 2024-08:19:54

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hal-04595122 , version 1 (30-05-2024)

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Luwei Yang, Neng Ren, Jun Li, Chinnapat Panwisawas, Yancheng Zhang, et al.. Thermal-solutal convection-induced low-angle grain boundaries in single-crystal nickel-based superalloy solidification. Journal of Materials Science and Technology, 2025, 208, pp.214-229. ⟨10.1016/j.jmst.2024.04.054⟩. ⟨hal-04595122⟩

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