PRO3D, Programming for Future 3D Manycore Architectures: Project Interim Status
Résumé
PRO3D tackles two important 3D technologies, that are Through
Silicon Via (TSV) and liquid cooling, and investigates their consequences
on stacked architectures and entire software development. In
particular, memory hierarchies are being revisited and the thermal impact
of software on the 3D stack is explored. As a key result, a software design
flow based on the rigorous assembly of software components and
monitoring of the thermal integrity of the 3D stack has been developed.
After 30 months of research, PRO3D proposes a complete tool-chain for
3D manycore, that integrates state-of-the-art tools ranging from system-level
formal specification and 3D exploration, to actual programming and
runtime control on the 3D system. Current efforts are directed towards
extensive experiments on an industrial embedded manycore platform.
Domaines
Informatique [cs]| Origine | Fichiers produits par l'(les) auteur(s) |
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