In this paper, we present an industrial challenge faced by electronic component manufacturers. From each order, the components need to be placed on panels for shipping. Panels incur significant costs. To control expenses, companies are compelled to optimize the placement of components on panels. Every day, thousands of orders have to be shipped. For each order, they have to pack between a hundred and a thousand rectangular electronic components of different sizes on panels with specifications such as free component orientation and tight time constraints. This packaging must be optimized to minimize the number of panels used and associated costs. The industrial challenge lies not only in space optimization but also in the speed of the process, with solutions needing to be found in less than a minute to meet the dynamic and continuous demands of production and shipping.