Mechanical analysis of Debonding Phenomena in Pavements - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2024

Mechanical analysis of Debonding Phenomena in Pavements

Résumé

Innovative solutions for maintaining and adapting old pavement structures hinge on a strong bond between surface layers. Despite advances in theoretical, numerical, and experimental approaches, the phenomenon of delamination in multilayered pavements is not well understood. This presentation explores how, aside from moving loads, climate change significantly complicates the mechanical analysis of the durability of pavement layer interface bonds. This issue is particularly acute for urban roads, where improvements are critically needed. Understanding and addressing these challenges is essential for developing resilient and long-lasting pavement structures in the face of evolving environmental conditions. https://ict.illinois.edu/outreach/kent-seminars/spring-2024/kent-seminar-presents-chabot
2024-03-21-ICTKentSeminar-AC.pdf (3.14 Mo) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)

Dates et versions

hal-04521353 , version 1 (29-03-2024)

Licence

Domaine public

Identifiants

  • HAL Id : hal-04521353 , version 1

Citer

Armelle Chabot. Mechanical analysis of Debonding Phenomena in Pavements. Spring 2024 Kent Seminar Series: Modeling and Mechanics in Transportation, Illinois Center for Transportation, Mar 2024, University of Illinois Urbana-Champaign, United States. ⟨hal-04521353⟩
8 Consultations
2 Téléchargements

Partager

Gmail Facebook X LinkedIn More