Scale-Up of Silver–Copper Composite Wires by Spark Plasma Sintering and Room Temperature Wire-Drawing for Use in 100 T Triple Coil at LNCMI - Archive ouverte HAL
Journal Articles IEEE Transactions on Applied Superconductivity Year : 2024

Scale-Up of Silver–Copper Composite Wires by Spark Plasma Sintering and Room Temperature Wire-Drawing for Use in 100 T Triple Coil at LNCMI

Domains

Materials Engineering Sciences [physics]

Anne Potier  : Connect in order to contact the contributor

https://cnrs.hal.science/hal-04513280

Submitted on : Wednesday, March 20, 2024-3:30:21 PM

Last modification on : Friday, May 17, 2024-4:18:03 PM

No file

Dates and versions

hal-04513280 , version 1 (20-03-2024)

Identifiers

Cite

S. Tardieu, J. Béard, D. Mesguich, A. Lonjon, N. Ferreira, et al.. Scale-Up of Silver–Copper Composite Wires by Spark Plasma Sintering and Room Temperature Wire-Drawing for Use in 100 T Triple Coil at LNCMI. IEEE Transactions on Applied Superconductivity, 2024, 34 (5), pp.1-4. ⟨10.1109/TASC.2024.3369011⟩. ⟨hal-04513280⟩

Export

BibTeX XML-TEI Dublin Core DC Terms EndNote DataCite

Collections

UGA CNRS INSA-TOULOUSE INC-CNRS LNCMI INSA-GROUPE FERMI TOULOUSE-INP UNIV-UT3 UT3-TOULOUSEINP CIRIMAT
20 View
0 Download

Altmetric

Share

More