Analysis of Thin Film Parylene-Metal-Parylene Device Based on Mechanical Tensile Strength Measurement - Archive ouverte HAL
Communication Dans Un Congrès Année : 2019

Analysis of Thin Film Parylene-Metal-Parylene Device Based on Mechanical Tensile Strength Measurement

Hyungdal Park
  • Fonction : Auteur
Wonsuk Choi
  • Fonction : Auteur
Ockchul Kim
  • Fonction : Auteur
Jinseok Kim
  • Fonction : Auteur

Résumé

This paper presents an FEM analysis and experiment of parylene-metal-parylene flexible substrate for implantable medical devices. Tensile strength measurement of the parylene-metal-parylene has been carried out and corresponding FEM modeling and simulation has been done to understand its mechanical behaviour. Besides, frequently encountered metal delamination on parylene substrate has been studied based on cohesive zone model of interface between the two materials.
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Dates et versions

hal-04341795 , version 1 (13-12-2023)

Identifiants

Citer

Seonho Seok, Hyungdal Park, Wonsuk Choi, Ockchul Kim, Jinseok Kim. Analysis of Thin Film Parylene-Metal-Parylene Device Based on Mechanical Tensile Strength Measurement. DTIP2019, May 2019, Paris, France. ⟨10.1109/DTIP.2019.8752695⟩. ⟨hal-04341795⟩
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