The effect of grain boundary structure on electrical resistivity for a pure metal - Archive ouverte HAL
Communication Dans Un Congrès Année : 2021

The effect of grain boundary structure on electrical resistivity for a pure metal

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Matériaux
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hal-04311925 , version 1 (28-11-2023)

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  • HAL Id : hal-04311925 , version 1

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Hanna Bishara, Lena Frommeyer, Subin Lee, Tobias Brink, Matteo Ghidelli, et al.. The effect of grain boundary structure on electrical resistivity for a pure metal. International Conference on Internal Interfaces (ICII-2021), Oct 2021, Castle Rheinfels, Germany. ⟨hal-04311925⟩
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