Stress Engineering of a Window Porous Silicon Layer based on Pseudo Substrate Suitable for III-V Monolithic Integration - Archive ouverte HAL
Article Dans Une Revue Silicon Année : 2023

Stress Engineering of a Window Porous Silicon Layer based on Pseudo Substrate Suitable for III-V Monolithic Integration

Résumé

Due to Silicon (Si) material abundance and specific properties, monolithic integration of III-V semiconductors on (Si) is of paramount importance for the next-generation in Optoelectronic devises. An alternative approach to lattice mismatched single silicon crystal substrates for heteroepitaxy is proposed. In this work, we have suggested a design of a compliant virtual substrate and we have explored the modulation of stress/lattice parameter of a window layer based on porous silicon pseudo-substrates allowing a defect free epitaxial growth. We prepared a silicon window layer with low porosity and variable thicknesses whose stress is modulated by the succession of several layers with gradual porosity. As a result, we evaluated the stress and the lattice parameter in compliant substrate before and after thermal annealing. The pores reorganization process was supported in Argon atmosphere at constant temperature (900 °C). The samples were studied morphologically by Field Emission scanning Electron Microscope (FE-SEM) and structurally by High Resolution X-Ray Diffraction (HR-XRD) and Nano-Raman.
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Dates et versions

hal-04311259 , version 1 (28-11-2023)

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Citer

Aicha Saidi, Imen Zeydi, Badreddine Smiri, Isabelle Berbezier, Ridha Mghaieth. Stress Engineering of a Window Porous Silicon Layer based on Pseudo Substrate Suitable for III-V Monolithic Integration. Silicon, 2023, 15 (14), pp.6085-6097. ⟨10.1007/s12633-023-02486-4⟩. ⟨hal-04311259⟩
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