Development of a plasma etching process of copper for the microfabrication of high-density interconnects in advanced packaging - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2023
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hal-04301212 , version 1 (22-11-2023)

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  • HAL Id : hal-04301212 , version 1

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J Borges, M Darnon, Y Beilliard, S Ecoffey, I de Sousa, et al.. Development of a plasma etching process of copper for the microfabrication of high-density interconnects in advanced packaging. IEEE 73rd Electronic Components and Technology Conference, 2023, Orlando (FL), United States. ⟨hal-04301212⟩
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