Comparison of Sintering Methodologies for 3D Printed High-Density Interconnects (2.3 L/S) on Organic Substrates for High-Performance Computing Applications - Archive ouverte HAL
Proceedings/Recueil Des Communications Année : 2023
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hal-04298936 , version 1 (21-11-2023)

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Shrivani Pandiya, Christophe Sansregret, Isabel de Sousa, Serge Ecoffey, Yann Beilliard, et al.. Comparison of Sintering Methodologies for 3D Printed High-Density Interconnects (2.3 L/S) on Organic Substrates for High-Performance Computing Applications. IEEE 73rd electronic components and technology conference (ECTC), IEEE, pp.1785-1791, 2023, ⟨10.1109/ECTC51909.2023.00306⟩. ⟨hal-04298936⟩
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