Influence of bimodal copper grain size distribution on electrical resistivity and tensile strength of silver - copper composite wires - Archive ouverte HAL Access content directly
Journal Articles Materials Today Communications Year : 2023

Influence of bimodal copper grain size distribution on electrical resistivity and tensile strength of silver - copper composite wires

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hal-04286104 , version 1 (15-11-2023)

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Simon Tardieu, David Mesguich, Antoine Lonjon, Florence Lecouturier-Dupouy, Nelson Ferreira, et al.. Influence of bimodal copper grain size distribution on electrical resistivity and tensile strength of silver - copper composite wires. Materials Today Communications, 2023, 37, pp.107403. ⟨10.1016/J.MTCOMM.2023.107403⟩. ⟨hal-04286104⟩
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