Laser welding for semiconductors
Résumé
Semiconductors were the only materials that couldn't be bonded using lasers, but a new solution taps compact nanosecond fiber sources emitting in the infrared (IR) domain. This breakthrough may further expand the range of applications of laser welding technologies. DAVID GROJO and POL SOPEÑA Using tightly focused ultrashort pulses, reliable micro-welding can be achieved through almost all types of transparent materials, including polymers, dielectrics, or even ceramics. In this approach, the two materials to be joined are placed in contact. The top one must be transparent to the laser radiation so the beam can propagate through and allow focusing at the interface. Upon absorption, both materials will melt and join after resolidification, leading to the bonding of both top and bottom pieces.
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