An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2023

An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules

Cyril Buttay
Eric Vagnon
Ildiko Ettinger
  • Fonction : Auteur
  • PersonId : 1294024
Besar Asllani
Céline Combettes

Résumé

This study investigated the thermal performance of a packaging solution designed to manage the electrical isolation and cooling of high voltage (> 3300 V) SiC power semiconductor devices. The proposed packaging merges the ceramic substrate and the heat exchanger into a single component, streamlining the overall design. Specifically, a novel heat exchanger is developed for a multi-chip module (20 kV), utilizing a combination of jet impingement and channel-flow cooling techniques. Computational fluid dynamics (CFD) simulations and experimental validation are conducted on a multi-chip module to assess the thermal resistance of this new cooling solution. The results demonstrate a low thermal resistivity of 0.118 cm 2 K/W, indicating the potential for improved cooling performance in high voltage and power density semiconductor applications.
Fichier principal
Vignette du fichier
Therminic_2023_submitted.pdf (1.27 Mo) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)
Licence : CC BY - Paternité

Dates et versions

hal-04240225 , version 1 (13-10-2023)

Identifiants

Citer

Amin Salim Obaid Al-Hinaai, Till Huesgen, Cyril Buttay, Eric Vagnon, Ildiko Ettinger, et al.. An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules. Therminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩. ⟨hal-04240225⟩
49 Consultations
15 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More