Observer based junction temperature estimation: 3D simulations and experimentations
Résumé
In this paper, a state-space modelling of power module with thermal sensors is proposed. This model is built from an identification method based on experimental and 3D simulation (6SigmaET) data. The purpose is to use automatic control theory to estimate the semiconductor jonction temperature. Hence, a Luenberger full state observer is implemented to estimate the jonction temperature. Such an algorithm uses the available measurements to adjust in real-time the jonction temperature estimation. The results were confirmed with an experimental bench test.
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